Key Benefits
- DUT'S installed inches from driver electronics
- Short signal paths for high-speed clocks and accurate device monitoring
- Accommodates virtually any device type from Bare-die to Multi Chip modules
- Custom tailoring to individual device requirements
- Easy installation and removal of DUT'S
DUT Package Types
- Metal, Ceramic, Silicon and Plastic packages
- Bare Die
- Laser, Pin Diodes on Subcarrier
- Eyelet Power packages
- Hi-Power Discrete packages
- PGA, DIP, SOIC, LDMOS packages
- Custom or Unique packages
- MCM, MMIC packages and Modules
- DC/DC Converters & Support (Bricks
DUT Electrical Connections
- Pogo-Pin on Land, fine pitch to 700 µm
- Metal in/on Elastomer
- Flex circuit, Soft Gold on 6 mil Polyimide
- SMA, SMB for RF applications
- High-temp discrete Sockets
- Custom or Unique BeCu, BeNi spring contacts
- Wire Bond to DUT
- Hi-Power Discrete Sockets
- Pin Grid Array Sockets
DUT technologies, materials
- CMOS, Bipolar, Linear Devices
- HBT, HEMT, PHEMT
- GaAs, GaN, SiC materials
- Microprocessor & Support
- Laser Diodes on Subcarrier
- Pin Diodes, Dark and Illuminated
- T/R modules
- RF Amplifiers
- Custom or Unique Devices
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